YADAV, Ranjana. Acrylamide Copolymerized Low Formaldehyde thermosetting Resin for Particle Board. Indian Forester, [S. l.], v. 151, n. 9, p. 891‐901, 2025. DOI: 10.36808/if/2025/v151i9/170553. Disponível em: http://indianforester.co.in/index.php/indianforester/article/view/170553. Acesso em: 7 nov. 2025.