Acrylamide Copolymerized Low Formaldehyde thermosetting Resin for Particle Board

Ranjana Yadav

doi:10.36808/if/2025/v151i9/170553

Acrylamide Copolymerized Low Formaldehyde thermosetting Resin for Particle Board

Authors

Ranjana Yadav Forest Product Division, ICFRE-Forest Research Institute, Dehradun-248006

DOI:

https://doi.org/10.36808/if/2025/v151i9/170553

Keywords:

Acrylamide, UF resin, FTIR, Formaldehyde emission, Bending strength etc.

Abstract

The decrease of formaldehyde emission in wood panel products is crucial, and it can be partially managed by modifying the resin. The perforator method (IS 13745:1993) was used to test the effectiveness of adding acrylamide (1.5 to 3.5%) to reduce formaldehyde emission from wood particle board. The functional groups of the produced control UF resin, mechanically modified acrylamide urea formaldehyde resin (AUF) and during reaction modified acrylamide urea formaldehyde resin (UFA) were identified by Fourier Transform Infra-red (FTIR). Indian standard 3087:2005 has been used for determination of physical and mechanical characteristics. The results show that the static bending modulus of rupture (MOR) of the manufacture boards ranged from 20.89 to 29.32 N/mm² of, and the modulus of elasticity (MOE) from 2986 to 3678 N/mm², while internal bond strength (IB) ranged from 0.43 to 0.52 N/mm². As per the requirements of IS 3087 (2005), 1.5% mechanically modified urea formaldehyde and 2.5% internally modified urea formaldehyde based agro composites yielded the best results for grade II particle boards with respect to static bending strength. From the studies, it was found that acrylamide addition (1.5% mechanically and 2.5% internally) reduces the formaldehyde emission content in the panel without affecting the mechanical qualities.

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